DIGITIMES / DigiTimes: IT news from Asia
Intel unveils 2D and 3D IC research breakthroughs to extend Moores Law – At the IEEE International Electron Device Meeting (IEDM) 2022, Intel unveiled research breakthroughs in 2D and 3D IC packaging technologies fueling its innovation pipeline for keeping its promises to put a trillion transistors on an integrated circuit (IC) by 2030. …
