Japanese semiconductor packaging material leader to expand production in China (DIGITIMES/DigiTimes: IT news from Asia)

DIGITIMES / DigiTimes: IT news from Asia
Japanese semiconductor packaging material leader to expand production in China – Sumitomo Bakelite, a leading Japanese manufacturer of synthetic plastics used in IC packaging, has announced a plan to build a new factory in China, investing JPY6.6 billion (US$45 million) in total. The new factory is scheduled to complete in 2023, and begin production in 2024, raising the capacity of packaging …

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