Willis Ke / DigiTimes: IT news from Asia
Cutting DDI production orders not an easy deal: QA with Chipbond Technology chair Fei-Jain Wu – Taiwan-based Chipbond Technology, now holding the worlds largest backend capacity for panel display driver ICs (DDI), continues to deepen cooperation with local OSAT Orient Semiconductor Electronics (OSE) and foundry United Microelectronics (UMC) to strengthen its business growth momentum. …
