Jack Purcher / Patently Apple
Apples UltraFusion Chip-to-Chip Interconnect uses TSMCs 3DFrabric Technology – In June 2021 Patently Apple posted a report titled TSMCs 3DFabric Technology is the next big wave in Chip Design that Apple will take advantage of in the not-too-distant Future. While TSMCs 3DFabric didnt first debut on an iPhone, a new report states that TSMC has clarified that Apples UltraFusion …
