Eifeh Strom / DigiTimes: IT news from Asia
ASE, Unimicron to provide packaging, related substrates for new Apple M2 chip – Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apples just unveiled M2 processors, along with Amkor Technology and Samsung Electro-Mechanics (Semco), according to industry sources. …
