Shannon Davis / Solid State Technology
ClassOne Technology and Fraunhofer ENAS to Collaborate on Hybrid Bonding for Advanced Imaging Device – Partnership will leverage firms respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density pixel array applications. ClassOne Technology and Fraunhofer ENAS to Collaborate on Hybrid Bonding for Advanced Imaging Devices was posted by Shannon Davis on Semiconductor Digest. ClassOne Technology, a global provider …
