Shannon Davis / Solid State Technology
CEA-Leti Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy an – In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour. CEA-Leti Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment …
