Taiwan testing and analysis companies stand out in 3D chiplet, third-gen semiconductors (Eifeh Strom/DigiTimes: IT news from Asia)

Eifeh Strom / DigiTimes: IT news from Asia
Taiwan testing and analysis companies stand out in 3D chiplet, third-gen semiconductors – Taiwans semiconductor supply chain will bring the biggest benefits to homogeneous/heterogeneous packaging, system-level testing (SLT), as well as advanced technology for materials analysis (MA), reliability analysis (RA) and fault analysis (FA). Heterogeneous integration will play an important role in driving advanced packaging and testing technology. …

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