Applied Materials Breakthrough in Electron Beam Imaging Technology Accelerates Development of the Wo (Shannon Davis/Solid State Technology)

Shannon Davis / Solid State Technology
Applied Materials Breakthrough in Electron Beam Imaging Technology Accelerates Development of the Wo – Applied Materials, Inc. today announced the commercial availability of cold field emission (CFE) technology, a breakthough in eBeam imaging that enables customers to better detect and image nanometer-scale, buried defects to speed the development and production of next-generation Gate-All-Around (GAA) logic chips as well as higher-density DRAM and 3D NAND …

Leave a Reply

Your email address will not be published. Required fields are marked *

Subscribe to our Newsletter